Used DISCO DFM M150 #9289901 for sale

DISCO DFM M150 is a high-precision scribing / dicing equipment that combines the best of two worlds, diamond tools and laser scribing technology. It offers precise processing of a wide variety of materials, such as silicon, glass, ceramic, and metal, with up to 1μm positioning precision and ±7μm alignment accuracy. It features a special vacuum engaging system that allows for high-speed high-precision machining and improves material placement accuracy. Additionally, DFM M150 is equipped with a high-precision detection unit for efficient vision alignment and a reliable safety switch which prevents material damage due to human error. The laser scribing machine offers precise and accurate cutting, scribing, and dicing of materials including semiconductor wafers, MEMS, LCD, and other substrates. It utilizes a CO2 laser with a maximum power of 1000W and a repetition rate of up to 80Hz. It offers a scanning speed of up to 1m/s and a laser beam size down to 500μm. The tool's Z-axis height control ensures precise cuts, scribes, and dices which helps to save time and reduce waste. Additionally, DISCO DFM M150 is also equipped with an integrated auto-alignment asset for quick and accurate material placement ensuring optimal accuracy of the laser machining. With its advanced technology, DFM M150 is the ideal solution for a wide range of precision machining applications such as semiconductor packaging, laser marking, laser welding, and MEMS. It offers enhanced productivity, precision, accuracy, and repeatability compared to traditional dicing and scribing processes. Additionally, its integrated safety systems and the vacuum model ensure a safe, accurate and stable performance for all your machining needs.