Used DISCO DFM M200 #293643257 for sale

DISCO DFM M200 is an automated scribing and dicing equipment designed for precision cutting, slicing and sectioning of wafer materials. It features an integrated precision scribing tool that is capable of achieving a snag rate of 0.062um or better. DFM M200 is equipped with an advanced scanning and analysis system that measures the integrity of the scanned material, reducing any defects before cutting. The automated scribing unit features a high-performance, high-accuracy overhead servo mechanism, with a head that can travel up to three times faster than conventional drilling and scribing systems. The scriber also incorporates an efficient anti-extra-scribing machine to ensure precise and precise positioning regardless of material or part size. For precise sectioning of high-density substrate materials,DISCO DFM M200 is outfitted with a precision dicing tool that utilizes a dedicated high-end imaging tool to accurately detect defects. The anti-extra-scribing asset applies a pre-defined force that is applied to a contact sensor to provide precise sectioning of each wafer. The overhead servo mechanism is equipped with an Auto-Scribing feature that automatically adjusts the scribe and dicing-tool pressure based on the material type and size, guaranteeing the position precision for each scribe and cut. To further improve dicing accuracy, DFM M200 features an automated measured pick & place device that precisely feeds wafer materials into the processing area with minimal vibration and disruption. This model is also equipped with a high-speed sorting device that automatically sorts and re-poses wafer materials, allowing for quick and precise separation of materials after dicing. The integrated software of DISCO DFM M200 provides an intuitive and user-friendly experience for operators. This includes functions such as scribing pattern recognition and automatic parameter optimization, as well as detailed diagnostic and maintenance functions. The equipment's software also offers a wide range of customization options, allowing users to tailor the system to their specific requirements. Overall, DFM M200 offers a reliable platform for industrial applications such as semiconductor production and laser marking. Its advanced scribing, cutting and dicing technologies provide the highest accuracy and repeatability available on the market today. With its intuitive user interface and flexible customization capabilities, DISCO DFM M200 is ideal for any demanding precision scribing and dicing needs.