Used DISCO DFM M200 #9023012 for sale

DISCO DFM M200 is a scribing and dicing equipment used to cut and finish plated surfaces and wafers. The system is equipped with an X axis stage for cutting and an Y axis stage for positioning of dicing tape. It is also equipped with a high precision spindle motor to cut the wafer and a high speed roller drive for a quick dicing process. DFM M200 is also equipped with an 8 " wafer transfer tray, a chuck, a multi-functional controller, a laser interferometer for alignment, an integrated dust collection unit, and a material handling machine. The tool is capable of slicing wafers up to 200μm in thickness and the maximum slicing speed is 20mm/sec. The asset also offers a number of features such as high precision cutting, high cutting speed, and a multi-directional working environment for dicing and grinding of plated surfaces. The model provides great accuracy and high processing speeds while cutting wafers. The spindle motor provides the equipment with a maximum cutting speed of 2mm/sec and an accura...