Used DISCO DGP 8761 #9036516 for sale

Name: DISCO DGP 8761
Brand: DISCO
SKU: 9036516
Availability: SoldOut

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Wafer Grinding, Lapping & Polishing

Manufacturer

DISCO

Model

DGP 8761

ID: 9036516

Fully Automatic Frame Wafer Thinning System for 6" Sapphire MACHINE STANDARDS Four (4) Chuck Table Configuration Three (3) Spindle Configuration Z3 Spindle Configured for Dry Polishing 2.4mm Height Gauge 150 mm Chuck Table Cassette to Cassette Operation Incorporated Wash Station Note – No transformer included Uninterruptible Power Supply Included INCLUDED OPTIONS Auto Setup Option Included DTU1531 Temperature Control Unit (No transformer included) Included Four (4) Wheels and/or Dry Polishing Pads Included 3-inch wafer capability in conjunction with 6-inch wafer capability (DP Pad Modification) SPECIAL OPTIONS 3-inch wafer capability in conjunction with 6-inch wafer capability (DP Pad Modification) 3.0mm Height Gauge Modification Endpoint Detection Software Wafer backside grinder 2012 vintage.

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DISCO DGP 8761 is a wafer grinding, lapping, & polishing equipment designed with the highest level of reliability and efficiency in mind. Powered by the latest wafer grinding technology, DISCO DPG 8761 is a robust and accurate machine that is capable of precisely grinding, lapping, and polishing wafers to the highest levels of quality and consistency. This highly advanced system is constructed using high-grade materials and components, allowing for long-term operation and dependable results. DISCO DPG 8761's powerful grinding mechanism utilizes an abrasive- loaded wheel to ensure maximum efficiency and accuracy. The wheel is further adjustable to fit the size and shape of the wafer being ground or lapped. Additionally, an on-board lapping and polishing unit is provided to perform surface finish tasks. This machine utilizes two rotating polycrystalline diamond lapping plates and has the ability to polish and refine the surfaces of the wafer to the desired quality and smoothness. DISCO DPG 8761 is equipped with a variety of control features for accurate operation. The tool offers an intuitive operator interface, making it easy to understand the asset's operation and manage the process accordingly. Additionally, a variety of integrated safety features are included to ensure the safety of the operators and the stability of the model. This includes an emergency stop button, monitoring functions, and a dust collection equipment that keeps the working environment clean and safe. Finally, an automated system monitoring unit is provided to ensure DISCO DPG 8761 operates at peak performance. This machine automatically records the operating parameters of the machine, enabling the user to understand and optimize the process accordingly. Overall, DISCO DPG 8761 is an efficient and reliable wafer grinding, lapping, and polishing tool that is capable of producing precise results that meet industry standards. This highly advanced asset offers the latest in grinding, lapping, and polishing technology, providing the customer with consistent, quality results.