Used DISCO DWR 1720 #9262809 for sale

DISCO DWR 1720 is an advanced laser scribing / dicing equipment designed to enable users to simultaneously scribe and dice a wide range of materials including semiconductor wafers, ceramic components, and MEMS packages. The 1720 uses a 410nm continuous wave laser with power levels adjustable up to 140 watts, giving it the potential to deliver superior cutting speed and processing accuracy in comparison to other similar systems. In addition, it has a wide range of scan, speed, and power settings to ensure users can tailor their scribe and dice process to materials and applications as needed. The laser module is integrated into a fully automated processing platform, allowing for automated loading and unloading of wafers, table shifting, and z-axis control for precise substrate positioning. This laser scribing / dicing system features a large working area of 200mm x 200mm enabling it to support full length wafers of up to 8 inches and individual dies of up to 4mm square. Advanced control algorithms ensure precise pattern control, pinpoint accuracy, and smooth runs with minimal chip/die breakage. DWR 1720 also makes use of an innovative AW-MP optical unit for low loss beam pointing and flexible f-theta lens, making it possible to switch amongst different working distances and focus depths easily. The large variety of additional modules available for the machine - such as auto-focus, 3D centering, and a metrology tool - make it an ideal choice for any production environment. All in all, DISCO DWR 1720 is an excellent choice of laser scribing / dicing asset for those looking for superior performance as well as flexibility and reliability.