Used DISCO EAD 6340 #9192445 for sale

DISCO EAD 6340
Manufacturer
DISCO
Model
EAD 6340
ID: 9192445
Dicing saws.
DISCO EAD 6340 is a 'scribing / dicing' equipment for wafers, dies and packages. It is a highly automated laser-micromachining tool which provides precise alignment, angles and dimensioning for applications in the microelectronics,packaging and related industries. EAD 6340 is designed to be an exceptionally reliable and versatile tool. It utilises laser scribing technology, where a focused beam of light is used to dislodge chips of material from a substrate, to create precise lines and patterns on a single layer or multiple layers of microelectronic components. This allows users to divide finished substrates into individual dies, as well as scribe lines and add added features to finished dies. The system is designed to reduce cycle times, enable wafer levelling, provide feature tolerances of 0.1 micron and enable multiple cutting angles with a small footprint. The unit is housed in a 503 mm x 1280 mm footprint, which can be quickly reconfigured for maximum flexibility. It consists of a single stage with an integrated precision x-y, z axis and a 500 mm x 450 mm table. DISCO EAD 6340 has a cutting speed of up to 2000 mm/sec and a focus of 1.5 microns, allowing for high-quality scribing and dicing results. The machine is further equipped with a 3D vision tool for high-precision alignment and vision-guided cutting, as well as the potential for real-time product tracking. The asset is designed with safety in mind and is UL cUL rated and CE certified, Non-Contact Interlock Switch (NCIS) compliant, comes with an IP54 rated dust seal and has class 1 laser product certification. This ensures operational safety, as well as compliance with local regulations and standards. EAD 6340 has been designed to guarantee cutting quality and allow for uniformity across substrates of different materials and sizes. It is also suited for scribing multiple angles and arbitrary patterns. The use of laser ensures that it is suitable for a wide range of wafer and die materials including silicon, SiC, GaN and glass, amongst others. Overall, DISCO EAD 6340 is a reliable and versatile 'scribing / dicing' model which offers precision cutting, high-speed operation and a small footprint. It is designed to improve process flow, accuracy, speed and reduce waste. the equipment is compliant with local regulations and is designed with safety in mind.
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