Used DISCO EAD 6340 #9357322 for sale

DISCO EAD 6340
Manufacturer
DISCO
Model
EAD 6340
ID: 9357322
Dicing saw.
DISCO EAD 6340 is a state of the art scribing/dicing equipment that is designed to provide maximum performance and accuracy for the fabrication of semiconductor devices. The system is capable of performing a variety of tasks such as: - Layer scribing and dicing of the substrate such as silicon wafers. - High-resolution scribing of the pattern onto the substrate. - Edge trimming to cut away any excess material from the edges of the substrate. - Laser welding of the dielectric layers of the semiconductor device. - Laser marking of the top surface of the part. EAD 6340 features three workstations; the Scribe Station, Dicing Station, and Edge Trim Station. The Scribe Station utilizes a high-resolution, motorized optical head with a scanning range of ±45°. This feature is capable of scribing a wide variety of line widths and angles to ensure the highest level of accuracy. Additionally, the analog servo controller unit offers full 3-axis control and repeatability for repeat pattern fabrication. The Dicing Station offers the capability to dice through substrates up to 500 μm in thickness. The machine's autofocus feature, laser diode, and adjustable pass depth help to ensure complete cutting of the substrates. The Edge Trim Station is equipped with a high-speed, high-accuracy cutting gun and advanced programming features to ensure precision trimming of the edges of the substrates. Furthermore, DISCO EAD 6340 provides dual-axis, automated laser welding of the dielectric layers of the device. The laser diode offers a high degree of accuracy and repeatability while the dual-axis force control tool ensures maximum accuracy. Lastly, Laser marking and recording of the top surface of the part is available for a variety of materials. The asset features an automated height control and high-precision, motorized positioning for precise, repeatable markings. Overall, EAD 6340 provides a variety of features and capabilities to ensure accuracy and repeatability for the fabrication of semiconductor devices. With its motorized optical head, dual-axis force control, height control, and advanced programming features, it offers a superior solution for scribing/dicing operations.
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