Used DISCO EAD 6340R #9262549 for sale

DISCO EAD 6340 is an automated precision scribing and dicing equipment designed for dicing of semiconductor wafers. The system utilizes a prober-mounted laser dicer—a tool that incorporates both a scribing laser and a diamond-tipped dicing blade for scribing and dicing of wafers. The unit integrates a wide operating range of 10-200µm scribe allowance, up to 2-inch maximum wafer size, and ±300µm scribe pitch accuracy. The EAD 6340 utilizes high powered CO2 laser scribing which produces precise groove and micro-tip features. In deep line scribing applications, the laser head is designed to provide a clean cut during post-scribe editing and while scribing high reflection and absorption substrates. Moreover, the laser head features high rigidity to ensure very high accuracy for wafer processing. For dicing, the EAD 6340 includes a hot air jet machine for cooling the dicing blade along with a laser scan tool for adjusting the dicing blade's cutting angle and distance. Additionally, the asset is equipped with a high-precision three-dimensional motion controller which is capable of accurately controlling the position and movement of the dicing blade. With advanced motion control technology, the EAD 6340 supports high speed processing even when process conditions change. Furthermore, the EAD 6340's integrated automated alignment model utilizes an embedded video equipment for accurate alignment of wafer slices on the substrates. In addition to highly accurate alignments, the system utilizes an advanced wafer edge recognition unit to improve process uniformity and wafer yield. The EAD 6340 also includes integrated safety features such as a high-pressure safety valve and a fume collection machine that protect the environment and workers by preventing emissions of gases and particles. Furthermore, the tool's user-friendly graphical user interface ensures easy and intuitive operation for efficient wafer processing. Overall, DISCO EAD 6340 is a capable and versatile automated asset for precision scribing and dicing of semiconductor wafers. Its sophisticated model design ensures consistently accurate and reliable performance for a range of complex fabrication tasks.