Used DYNATECH DT-WDB-2030A #9148587 for sale

DYNATECH DT-WDB-2030A is a state of the art scribing and dicing equipment designed specifically for the semiconductor industry. It is one of the most advanced systems for this purpose available, offering superior control, versatility, and reliability. The system's built-in precision metrology devices provide exact measurements of substrate movement in all axes, enabling precise control and flexibility. This unit utilizes an acousto-optic laser technology, which allows for cleaner, higher quality cuts, as well as faster throughput and production. The laser is also able to generate letters and logos on veneers, as well as other shapes and patterns. DT-WDB-2030A features a fully automated process control machine for control of substrate positioning and static laser cutting. This provides for a more consistent and accurate product. Other features include multi-head and multi-substrate options for increased throughput, and software-driven process monitoring to ensure the highest product quality. The machine has a maximum processing area of 8"x8" (200mm). It is capable of utilizing substrates of up to 0.25" in thickness (6.4mm). It is also capable of scribing at multiple speed levels, with a maximum scribing power of 1.2 kw/mm. The tool is easy to install and operate, while providing a high level of flexibility in substrate alignment and process control. It is designed to withstand high temperature, humidity, and ambient pressure, making it ideal for use in a variety of environments. DYNATECH DT-WDB-2030A provides the accuracy and high speed production capabilities needed for today's semiconductor processing requirements. With its precision measurement and control capabilities, as well as its multiple head and multi-substrate options, this asset is sure to meet the needs of those seeking to improve their production process.