Used DYNATECH DT-WDB-2050A #9301138 for sale

DYNATECH DT-WDB-2050A is a precision scribing and dicing equipment designed for the efficient cutting and separation of silicon wafers and other substrates. The system is used for a variety of applications in the semiconductor, optoelectronic, MEMS, and other precision industries. DT-WDB-2050A features a table top design with a 300 x 300mm work area, making it ideal for small-scale production. The unit is capable of working with both 3" and 4" wafer sizes, and can handle thicknesses up to 500 µm. The machine is quick and easy to set up and adjust, making it suitable for high-volume production. DYNATECH DT-WDB-2050A is equipped with a high-power diode-pumped YAG laser with a pulse energy of up to 1.2J. The tool offers variable repetition rates of up to 40kHz for dicing operations, and variable power control for scribing operations. The variable power control allows the asset to precisely control the cutting width and depth, enabling high-precision dicing with virtually no warping or damage. In addition, the model features an adjustable-focal-length lens with a field-of-view of 145x140mm, allowing for improved imaging and cutting accuracy. The imaging equipment also features a built-in focus adjustment, automatic blanking, and signal detection. This equipment allows the operator to easily and accurately adjust the focus of the laser beam and precisely control the cutting width and depth. The system is highly reliable, with cutting accuracy of up to two UV laser unit within ±2µm. This ensures that quality, uniform cuts are consistently achieved. Furthermore, the machine is equipped with a number of safety features such as beam interlock, an interlock switch for sample dish removal, as well as an operator's key lock for preventing unauthorized access. DT-WDB-2050A is an industrially proven tool that provides reliable, precision scribing and dicing for a variety of applications. Its adjustable-focal-length lens and variable power control allow for high-precision cutting with minimal damage to the substrate. Furthermore, its high reliability and a number of safety features mean that quality, consistent performance is guaranteed.