Used DYNATEX 1010B #9045753 for sale

Manufacturer
DYNATEX
Model
1010B
ID: 9045753
Wafer expander.
DYNATEX 1010B is a high precision scribing and dicing equipment that is designed to meet the needs of the semiconductor, MEMS, and LCD industries. It is capable of cutting, splitting, and separation with high accuracy and repeatability. This precision system utilizes a CNC touch probe that allows it to accurately capture the exact dimensions of a work piece to ensure a perfect alignment of the scribe and dice tools. The unit's CNC regulator can automatically adjust the cutting speed accordingly to maintain a high cutting accuracy and repeatability. The machine also has a built-in tool presetting and calibration feature that ensures that the cutting tools are set to the correct parameters for any given work piece. In addition to the CNC touch screen and pick-up technology, 1010B is equipped with a high-power scribing laser. It delivers a powerful, high-resolution beam of energy to precisely scribe even the smallest intricate structures. Furthermore, DYNATEX 1010B integrates a unique set of abrasive cutting and slicing tools to separate different layers and components. These special chipping tools enable a precise separation of any given work piece while still preserving the integrity of the material. The cutting operations of 1010B can be programmed via a simple programmable user interface. This allows users to easily set up cutting operations and adjust parameters to ensure a precise final product. Furthermore, advanced options such as the automatic cleaning of the laser head are available when needed. DYNATEX 1010B is a high-precision scribing and dicing tool that offers industry leading accuracy and repeatability. It is ideal for any application that requires extremely precise and repeatable scribing and dicing operations. This asset also has the versatility to be used on a variety of materials such as glass, silicon, quartz, and ceramic. Furthermore, its advanced features make it an ideal choice for quality control purposes in microelectronic and MEMS production processes.
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