Used DYNATEX DX-II Plus #293592371 for sale

DYNATEX DX-II Plus is a precision scribing and dicing equipment that is ideal for use in the wafer processing and semiconductor industries. This system is designed for the efficient and accurate cutting and scribing of wafers and other substrates in the process of microfabrication. The unit offers a high level of speed and accuracy, with a linear movement velocity of up to 2.5 m/s and positioning accuracy of 0.5 µm. It is capable of multiple operations such as marking, cutting and scribing, along with additional features such as independent tension control. The machine also has an automated monitoring tool that guarantees a constant level of precision throughout its process. The asset has a high repeatability and reproducibility, with a dicing accuracy of 65 µm and repeatability of 1-3 µm. The device is fully controllable through its touch-screen interface, which allows the user to adjust parameters such as speed, pressure, power and more. The model is also highly flexible, with a wide range of optional attachments and tools, including vision systems and laser systems. DX-II Plus also helps minimize waste and reduce processing costs, thanks to its high-density cutting feature, which makes it possible to maximize yield by reducing the distance between cuts. This equipment is also easy to operate and maintain, as it features a sealed system that is free of dust, and its internal components are built to last and have low maintenance requirements. Overall, DYNATEX DX-II Plus scribing and dicing unit is a reliable and robust machine that is well suited to the production of high-quality wafers and substrates in the semiconductor industry. It provides the user with excellent accuracy, repeatability, and controllability, helping to maximize yield and reduce processing costs. With its wide range of options, and the support of an experienced customer service team, this tool is a reliable choice for any wafer processing and microfabrication needs.