Used DYNATEX DX-II #9156230 for sale

DYNATEX DX-II is a high-end precision scribing and dicing equipment designed for the most demanding applications. With its advanced controls, DX-II offers maximum performance in terms of accuracy, precision and repeatability without compromising high-volume throughputs. This system features an innovative FIB Etching Technology, which uses lasers to burn and define patterns on sapphire and silicon wafers. This unit is capable of processing substrates up to 8" in size (up to 8 mm thick) at up to 600 microseconds per pulse. The machine is also equipped with a tool-change machine which rapidly changes tools in order to quickly adjust parameters such as cutting or scribing depth. The integrated vision tool also offers enhanced accuracy and productivity while the PC-based user-interface software allows for easy operation. DYNATEX DX-II asset has an integrated chuck and linear actuator, which offers precise micrometer resolution and high speed motion, minimizing tooling costs and vibration. It also provides a high-powered 10kW CO2 laser that can scribe quickly and accurately, without damaging the substrate material. The integrated valve control model also provides the precision to control several parameters, such as pulse-width and laser focus. Positioning accuracy achieved with DX-II is less than 1µm, which enables the equipment to process crafts or sketches with extreme precision. Its wide range of lens configuration allows scribing or dicing of wafers of any size. In addition, its Pro-Cut programming software has an easy learning curve, meaning users can quickly learn and use the system within a short time with minimal training. Further, DYNATEX DX-II also offers full temperature and environmental control, enabling the user to precisely control factors such as humidity, temperature and pressure, which can significantly affect device performance, particularly when processing certain materials or substrates. In conclusion, DX-II is the most advanced scribing and dicing unit available, offering a combination of precision, speed and accuracy with the addition of valuable features such as FIB Etching Technology, advanced controls, an intuitive software and more. It is the perfect solution for a wide range of applications, ensuring maximum throughputs and high-quality results.