Used DYNATEX DX-III #62538 for sale
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ID: 62538
Wafer Size: 4"
Scribe and break system, 4"
Facilities:
Input voltage: 115VAC, 60Hz, 5A
CDA or N2: 60-85 PSIG, 0.5 CFM
Vacuum: 15-28 In. Hg, 0.5 CFM
Chip free breaking mechanism
Minimum die size: 0.005” Square (125µ)
Wafer thickness range: 0.004” (100µ) to 0.039” (975µ)
CCD Camera alignment system
Internal PC control system
DOS Operating system
Operators and maintenance manuals.
DYNATEX DX-III is a scribing and dicing equipment ideal for the cutting and grinding of hard and brittle materials such as silicon, metallized fiber, ceramics, quartz, and precision plastics. This system features motion control and laser processing in a single platform, combining superior performance and accuracy with a highly efficient design. It is designed to meet the demands of high-throughput, high-accuracy manufacturing. DX-III's advanced cutting techniques enable precise, high-speed cuts that remain consistent throughout the process. Its advanced laser processing offers an area coverage of up to 3mm2, resulting in superior cutting consistency and superior surface finish. The unit utilizes multiple spindles, allowing for simultaneous cutting and grinding operations and allowing for higher throughputs. DYNATEX DX-III also has a fast spindle machine that allows for high-speed processing, resulting in improved throughput and precision. DX-III comes equipped with a variety of features to improve its performance and efficiency. Its motion control tool facilitates smooth and precise motion of cutting, grinding, and laser processing tools. Its 5-axis motion control asset provides high-accuracy tool positioning, enabling precise and smooth movement of the cutting and grinding tools, while its laser processing capabilities offer optimized processing speeds. DYNATEX DX-III is designed for ease of use and offers an intuitive user interface for programming, along with simple operation and maintenance. Its user-friendly software tools provide an array of CAD tools for easy integration into automated production processes. Additionally, the model is built on open-platform architecture, which allows for future upgrades and customizations. Given its features and performance, DX-III offers an ideal solution for high-throughput scribing and dicing applications. Its advanced motion control equipment and laser processing capabilities ensure consistent and reliable performance, while its intuitive user interface, flexible architecture, and customizable solutions offer improved productivity and efficiency.
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