Used FICO / BESI FCLX #293637943 for sale

FICO / BESI FCLX is a precision scribing and dicing equipment designed for the most critical applications in the semiconductor industry. FICO FCLX system utilizes a unique optical scanning unit with a rotating drum and advanced automation algorithms to achieve unparalleled speeds and accuracy. The machine is capable of producing extremely precise cuts and patterns on flat, round, and complex substrates and materials. BESI FCLX tool incorporates a galvanometer-based machine that allows for 200mm wafer delivery. A scanning head is used to measure the three-dimensional shapes of the wafers with precision. A drum acts as the primary transport path and can rotate at speeds up to 250rpm. The drum also carries interchangeable scribing and plotting heads, each with their own set of custom-programmable parameters. FCLX asset is capable of scribing on the top and bottom side of the wafer simultaneously, allowing for the highest levels of accuracy, precision and throughput. The scriber heads and plotting heads move independently from each other to achieve the desired cuts and patterns on each side of the wafer. The model can be programmed to cut a variety of lines, circles, squares and other shapes as needed, as well as produce intricate images and logos with high resolution. FICO / BESI FCLX equipment also incorporates an advanced automation algorithm and software for full, integrated operation. This streamlines the process and provides optimized throughput, minimizing setup and operation times. The system allows customers to remotely access the software, monitor production, and create custom cutting patterns and designs. FICO FCLX unit is an ideal solution for any of the most demanding scribing, cutting, and engraving applications. Its unmatched precision, speed, and flexible programming make it the ideal precision scribing and dicing machine.