Used GERINGER FM2 #9378200 for sale

GERINGER FM2 is a scribing / dicing equipment that combines mechanical, laser cutting, and CNC technology to offer a versatile and reliable scribing / dicing solution for small, medium, and large production requirements. The system incorporates a two-axis motion platform powered by precision linear guide rails and ball screw drives adept at carrying out automated, high-speed, high-accuracy scribing of semiconductor materials, e.g. wafer backgrinding. The unit utilizes a state-of-the-art laser dicing module featuring fiber-coupled laser diodes integrated with a high-speed, high-accuracy cutting head. This head is capable of accurately slicing and dicing wafer backgrinding in a single pass, with the capability to maintain spot sizes as small as 15 microns. FM2 is also equipped with a CNC spindle module including a high-precision motor drive to ensure precise, accurate, repeatable motion. The CNC spindle module is perfectly suited for deep groove scribing tasks and other similar CNC machining applications. GERINGER FM2 also comes with an integrated vision machine to track, monitor, and monitor and measure the accuracy of the scribe line. This integrated vision tool is also capable of recognizing and measuring component marks for further accuracy control. For enhanced performance, FM2 utilizes a single integrated software platform for data input, processing, and monitoring of all tasks. It also supports user-generated macros for task customization. Additionally, the asset features redundant controllers and feeds to ensure maximum uptime and safe operation. All components are designed to operate and function together in a modular fashion while maintenance is minimized, and operators are provided the utmost flexibility for operation. In short, GERINGER FM2 is a high-performance yet cost-effective scribing / dicing solution that offers precise, high-speed, and high-accuracy scribing and dicing of semiconductor materials. Its modular design and integrated components provide enhanced accuracy and performance while allowing for simple operation and minimal maintenance. For manufacturers looking for a powerful yet versatile machine for precision scribing and dicing of wafer backgrinding and other semiconductor materials, FM2 is an ideal choice.