Used HITACHI CB 75FA #92584 for sale

HITACHI CB 75FA is a state-of-the-art scribing and dicing equipment designed for complex multi-layer die applications. The system features advanced technology designed to provide superior precision and accuracy in dicing and slicing operations. This unit is suitable for applications involving layers of silicon, glass, ceramics, and other non-metallic substrates. The scribing and dicing machine includes an advanced LED illumination, an advanced camera-controlled X-Y stage, and a precise vision alignment process. The LED illumination illuminates the sample from underneath, providing excellent visibility for high-resolution imaging. The advanced vision alignment process ensures accurate placement of the X-Y stage over the sample. This precisely positions the stage for precise scribing scissors or dicing blades. The tool's superior Y-axis capability provides superior precision in slice and dice applications. The asset is capable of slicing tiny, complex structures with a minimum of burrs and damage. It is capable of slicing up to 0.3 mm within +/- 10 µm accuracy. The model also features an integrated cooling station that keeps the blade temperatures below maximum operating temperature, thus reducing distortion and improving dicing performance. CB 75FA's advanced camera equipment ensures optimal results by providing detailed images of the sample's surface. The system's advanced CCD camera has a resolution of 10,000 x 10,000 pixels, allowing for precise positioning of the cutting blades. The unit also features an integrated cutting oil delivery machine to ensure proper cooling and lubrication of the blades. The cutting oil delivery tool is equipped with a temperature and flow sensors, providing precise temperature control during dicing operations. In addition to the cutting capabilities, HITACHI CB 75FA also includes a powerful cleaning mechanism that can remove miniscule particles from the blades. The asset employs a high-pressure air blast that eliminates particles generated during dicing. Lastly, the model also includes an intuitive user interface, making it easy to adjust settings, monitor operations, and track cutting performance. CB 75FA is a reliable and powerful tool for any scribing or dicing task. It is ideal for high accuracy and precision applications in complex multi-layer die applications.