Used HTA WB-1100 HE #293644432 for sale

HTA WB-1100 HE is a scribing and dicing equipment utilizing a powerful rectified high-frequency laser in combination with high-precision glass interferometry optics. It is designed specifically for accurately cutting and scribing a broad range of materials, with a particular focus on semiconductor wafers and solar cells. The powerful laser uses high-frequency rectification technology to ensure an exceptionally high power output and can be used to accurately and quickly scribe and dice through materials up to 8mm thick. The processed material is then divided into small segments, an action that is referred to as "dicing". The cutting and scribing actions are performed in one step, without the need to re-position the material. This significantly increases efficiency, accuracy and productivity. WB-1100 HE is a highly reliable system, with features such as a unique vibrationand dust-resistant laser galvo drive unit and a frame composed of lightweight and highly rigid aluminum molded components. This improves the machine's accuracy and reliability exponentially. The tool also features a high-grade, low-noise glass interferometry optics which are a significant step up from the traditional optical systems most other machines use and, hence, provide a much higher level of accuracy for all processes. In terms of safety, the asset utilizes a number of protective measures such as an air extraction model, a beam shut-off function, a tube temperature detection equipment, an overload protection system and an access door safety lock. This ensures that safety is maintained throughout the entire operation. HTA WB-1100 HE is capable of being integrated into multiple existing production processes and is ideal for cutting, scribing, engraving and etching wafers, solar cells and various other components. It also features an adjustable focal length and can be used to process several materials, including glass and metal. The unit contains multiple automated features such as a high-precision control machine and a power supply monitoring tool, which allow it to be easily adjusted to different production processes. Overall, WB-1100 HE is a highly reliable, accurate and efficient scribing and dicing asset designed specifically for processing semiconductor wafers and solar cells. It is capable of cutting and scribing materials up to 8mm thick and contains multiple automated features to ensure simple integration into existing production processes. It also features numerous safety mechanisms to ensure the safety of the operators.