Used HTA WB-1100 #293757442 for sale

HTA WB-1100 is a multi-purpose equipment for the scribing/dicing of semiconductor materials. This system combines both scribing and dicing processes for the optimum cutting of materials such as silicon wafers, ceramic packages, and printed circuit boards. WB-1100 features a 6-axis robotic arm for exact movement, an automatic tool changer, an advanced 3-axis spindle, and a multimode safety unit. The 6-axis robotic arm of HTA WB-1100 is designed to enable precise movements of the cutting tool. It is also capable of working in hazardous areas and is programmable to the shape of the product. This robotic arm allows for precision movements and positioning as well as increased production speeds. The automatic tool changer makes it possible to quickly change from one cutting tool to another. This feature helps to reduce setup time and increase process productivity. The 3-axis spindle offers cutting speeds of up to 300,000 rpm for faster performance. It is also equipped with a liquid-cooling machine for optimum temperature control. WB-1100 is designed to be safe and reliable. The tool utilizes a multimode safety asset with multiple levels of protection from dust, light, and noise. It also includes safety features such as motion control and environment monitoring. The safety model ensures the stability and accuracy of the scribing/dicing process. HTA WB-1100 is an efficient and reliable equipment for scribing/dicing. It is designed for use in industrial and research applications and offers efficient production speeds, accurate positioning, and reliable operation. This system is perfect for any application that involves the cutting of semiconductor materials.