Used KAYEX / HAMCO (Scribing / Dicing) for sale

Kayex / Hamco is a leading manufacturer of scribing and dicing equipment used in the semiconductor industry. These systems are designed to accurately and efficiently cut and separate semiconductor wafers into individual chips. One of the main advantages of Kayex / Hamco scribing / dicing units is their high precision. These machines use advanced optical alignment technology to ensure precise alignment of the cutting blade with the wafer. This enables clean and accurate cuts, resulting in high yield and quality chips. Additionally, these tools are equipped with advanced software algorithms that optimize the cutting process, further enhancing precision. Another advantage of Kayex / Hamco scribing / dicing assets is their versatility. These models can handle various wafer sizes and materials, making them suitable for a wide range of applications. Whether it is slicing silicon wafers for microprocessors or cutting gallium arsenide wafers for optoelectronics, Kayex / Hamco equipment can handle the task efficiently and reliably. Examples of Kayex / Hamco scribing / dicing systems include the Model 900 and Model 1200. The Model 900 is a manual dicing system that offers high precision cutting and is suitable for small-scale production or research and development environments. On the other hand, the Model 1200 is a fully automated dicing system that can handle high-volume production with minimal operator intervention. It features advanced robotic handling and alignment capabilities, ensuring consistent and reliable cutting results. Overall, Kayex / Hamco scribing / dicing units are known for their precision, versatility, and reliability, making them a top choice for semiconductor manufacturers worldwide.