Used LOADPOINT MicroAce 66 #189213 for sale

LOADPOINT MicroAce 66 is a scribing and dicing equipment that is designed to provide automated scribing, dicing, and die bonding of micro and nano electronic components. The system is equipped with a highly advanced 6-axis motion unit that enables precision and repeatable motion control. This machine has been designed to integrate all the features of a complete micro- and nano-fabrication tool, including scribing and dicing operations, die bonding, and surface finish. The scribing asset utilizes a powerful 6-axis motion model that provides precise motion control with repeatability of less than 1 micron. This equipment works with an infrared laser micromachining system that provides laser beam accuracy of 5 microns. The scribing unit utilizes a low-noise, high-precision servo drive for smooth operation and requires minimal maintenance. In addition, the machine features a two-speed laser control to enable quick and precise scribing. The dicing tool is equipped with a high-speed soldering head and an automated feeder asset that can handle thin-film and thick-film components. The model is capable of soldering, derimming, and diamond cutting operations. The equipment allows for high-precision, highly repeatable dicing and has an accuracy of less than 2 microns. The die bonding system uses a six-axis manipulator unit that enables precise, highly repeatable adhesion control. The machine uses high-precision hardware and software to ensure accurate placement and bonding of components. This tool is ideal for use with advanced integrated circuit packages. Finally, the surface finish asset is capable of applying precisely controlled coatings to components. This model uses an advanced electrodeposition equipment to apply uniform layers of silver and gold, thereby providing excellent electrical and thermal performance for various components. Overall, MicroAce 66 is a powerful and precise scribing and dicing system which is capable of providing the precision and repeatability needed for micro- and nano-scale components. This unit is ideal for advanced manufacturing operations in the electronic device industry and can be used for a variety of applications.