Used LOADPOINT NanoAce #189214 for sale
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ID: 189214
Wafer Size: 12"
Dicing saw, 12"
Specifications:
Air-bearing spindle motion control provided in (4) axes: X, Y, Z, Theta
Work pieces: Up to 305mm
CE marked
Capable of processing:
Alumina
BGA moldings
Ceramic
Glass
GaAs
Sapphire
Germanium
Ferrite
PZT
Silicon.
LOADPOINT NanoAce is a modern scribing and dicing equipment designed to provide superior accuracy when dealing with incredibly small substrates. The system uses an advanced laser scribing unit that can draw lines and patterns with widths as small as 1 μm, while maintaining accuracy of better than 1 μm. The scribing machine is paired with an ultra-precise dicing tool, which operates at up to 500 kHz and can accurately cut products as small as 2 x 2 mm. The laser head of NanoAce can be easily adjusted to produce different kinds of patterns, including straight lines, circles, ellipses, and Bezier curves. It can be used with different materials including nanomaterials, semiconductors, and even medical devices. Additionally, the laser head can be used for other processes such as drilling, ablation, and welding. The dicing asset of LOADPOINT NanoAce is designed to provide sharp and fast cuts without damaging the substrate. It's equipped with stainless steel blades that are incredibly sharp, enabling them to precisely cut a variety of materials with minimal chipping. The dicing model also includes a Vision Guidance Equipment that monitors the cutting process in order to ensure maximum accuracy. It also has a "Zero Contact" feature, which uses air pressure to keep the blades from coming into contact with the substrate. In addition to scribing and dicing, NanoAce can also be used for a variety of finishing processes such as deburring, cleaning, and polishing. The system is incredibly reliable, and can handle long production runs without any major issues. It's also easy to maintain and clean, making it an ideal choice for both large and small production runs. Overall, LOADPOINT NanoAce is a powerful scribing and dicing unit that provides superior accuracy and reliability. Its advanced laser scribing head and ultra-precise dicing machine can handle a variety of projects, and its range of additional finishing processes make it an incredibly versatile tool. This asset is perfect for a variety of applications, from semiconductor fabrication to medical device production.
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