Used LOOMIS LSD 100 V5 #9097763 for sale
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ID: 9097763
Vintage: 2008
System
Fast break system
Adjustable table speed
Adjustable roller pressure
High multiplicator display unit
Wafer alignment unit
Monitor: V22K100, 21"
Pressure requirements: 65 to 80 psi, 455 kPa
Operating temperature range: Altitude to 2000 m, 5-40°C
Humidity temperature: 80% - 31°C, decreasing to 50% at 40°C
Input voltage variance: ± 10% (Nominal)
Power consumption: 0.58 A
AIC Breaker requirement: 10,000 A
Spare parts:
Qty / Part number / Description
(2) / LMB-00001-00 / Steel shim, 4 mils
(3) / LMB-00002-00 / Plastic shim, 10 mils
(9) / LMB-00002-01 / Plastic shim tan, .004" 12" x 24"
(9) / LMB-00002-02 / Plastic shim blue, .005" 12" x 24"
(4) / LMB-00003-00 / Roller O-rings
(1) / LMB-00004-00 / Subminiature pressure regulator (5850-0062)
(1) / LMB-00005-00 / Table magnet
(1) / LMB-00006-00 / Roller motor
(1) / LMB-00007-00 / Table magnet
(1) / LMB-00009-00 / Ring lamp, 6W
(2) / LMB-00009-01 / Ring lamps light bulbs, 6W
(1) / LMB-00010-00 / LED 60T Group
(1) / LMB-00011-00 / SONY LCD Monitor LMD-1410
Power: 110 V, 60 Hz
2008 vintage.
LOOMIS LSD 100 V5 is a high-precision scribing and dicing equipment designed for the precise machining of various material types, particularly semiconductor wafers used in the manufacturing of microelectronics components. This advanced system incorporates cutting-edge technology and a range of features to ensure accuracy, efficiency, and reliability in the scribing and dicing process. At the core of LSD 100 V5 unit is a robust and stable platform that provides the foundation for precise machining operations. The machine features a granite base and a precision linear motor-driven stage that enables smooth and precise movement in the X, Y, and Z axes. This high level of motion control is essential for achieving accurate scribing and dicing results, particularly when working with delicate and often expensive materials like semiconductor wafers. One of the key components of LOOMIS LSD 100 V5 tool is the cutting tool assembly, which is responsible for performing the scribing and dicing operations. The asset is equipped with a high-speed spindle motor that drives a precision cutting tool, such as a diamond blade or wheel, capable of making precise cuts with minimal chipping or damage to the workpiece. The cutting tool assembly is designed to provide optimal performance and long-term reliability, ensuring consistent and high-quality results. LSD 100 V5 model is equipped with advanced control and automation features that enhance the efficiency and accuracy of the scribing and dicing process. The equipment features a user-friendly interface that allows operators to easily input cutting parameters, set cutting paths, and monitor the machining process in real-time. Additionally, the system can be programmed to perform complex cutting patterns and sequences, making it suitable for a wide range of applications in the semiconductor and microelectronics industry. To ensure precision and repeatability in the scribing and dicing process, LOOMIS LSD 100 V5 unit incorporates advanced vision and alignment systems. These systems use high-resolution cameras and image processing algorithms to accurately detect the position and orientation of the workpiece, as well as align the cutting tool to the desired cutting path. This level of precision is essential for achieving tight tolerances and maintaining the integrity of the workpiece during machining. In addition to its high-precision machining capabilities, LSD 100 V5 machine is designed for versatility and flexibility in handling a wide range of materials and geometries. The tool can be equipped with various cutting tools and accessories to accommodate different material types, thicknesses, and cutting requirements. Whether scribing delicate semiconductor wafers, dicing ceramics, or cutting glass substrates, LOOMIS LSD 100 V5 asset offers the versatility and performance needed to meet the demands of modern manufacturing processes. Overall, LSD 100 V5 model sets a new standard for high-precision scribing and dicing systems, combining cutting-edge technology, advanced control features, and versatile capabilities to deliver superior machining performance in the semiconductor and microelectronics industry. Its stability, precision, and automation features make it an ideal solution for manufacturers seeking to achieve high-quality results and maximize productivity in their scribing and dicing operations.
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