Used MECO / FICO Conversion kit for MISS II #293629508 for sale

MECO / FICO Conversion kit for MISS II is an automated scribing/dicing equipment designed specifically for use in the production of medium to high-performance surface-mounted electronic components for printed circuit boards. The system comprises of a number of components, including a dielectric scribing laser, a focusing lens, and a detector head with either a camera or light-detecting sensor. The dielectric scribing laser is a Raman fiber laser diode that uses a Raman fiber as its core. The laser is capable of generating high optical power with a peak power of up to 60W, with the output delivered along the length of the fiber. The laser beam is focused using a special focusing lens, which is designed to focus the beam onto a small spot size to create thin, precisely cut lines along the substrate surface. The detector head is used to detect the scribed lines and is configured to detect either a camera or a light-detecting sensor. The camera detects the scribed lines and creates a two-dimensional image of the substrate surface. The light-detecting sensor detects the scribed lines and creates a controller signal that provides feedback to the laser unit's control systems, allowing the user to adjust the laser power and frequency as needed to achieve the desired cut quality. The laser machine is housed in a durable and compact package designed to be easily movable and transportable. The tool is designed for easy set-up and configuration, and can be operated with minimal training or knowledge. Once the asset is set-up, the user simply runs the program and the laser scribes along the surface of the substrate. The model is capable of automatically recognizing the scribing layers and accurately slicing along them without the need for manual intervention. MECO Conversion kit for MISS II is a reliable and highly efficient scribing/dicing equipment that meets the needs of medium to high-performance surface-mounted electronic component fabrication. The system is designed to precisely cut through substrates up to 6mm thick and can easily be adapted for different substrates and components.