Used MEYER BURGER SW288 #293663167 for sale

MEYER BURGER SW288 is a scribing / dicing equipment designed to process a range of thin-film materials. It can be used to prepare photovoltaic wafers, silicon wafers, and other semiconductor substrates with consistent accuracy. The system utilizes a computer controlled X-Y motion stage and an optical imaging unit to locate, scan and cut thin-film materials, allowing it to make precise cuts and grooves in materials of different widths. SW288 can process wafers up to 8 inches in diameter and up to 1.6 mm thick. It features a raster-based scribing mechanism which enables easy calibration and high accuracy throughout the scribing process. The machine utilizes a high-accuracy piezo-electric positioning that results in precise motion across the wafer. It also features a laser safety monitoring tool which ensures that the operator is always aware of an active beam in the workplace. The asset utilizes a hybrid electroforming process to achieve optimal results. It utilizes a laser to form a series of grooves in the material and then uses electricity to etch the grooves further. The result is a pre-determined pattern with excellent accuracy and no distortion of the material. MEYER BURGER SW288 offers a complete range of user-friendly features for maximum efficiency. It comes with a highly automated user-interface and flexible cutting settings. It allows for a wide range of cutting strategies, including zigzag cuts, line cuts, and circular cuts. It even allows for the cutting of various angles from 0 to 600. Additionally, the model features an automated job-logging equipment that records user-selected parameters and allows for easy review of past processes. Overall, SW288 is an advanced scribing / dicing system that provides top-level performance with every application. Its automation, user-friendly features, versatile cutting strategies, and job-logging unit allow for maximum efficiency and accuracy in processing thin-film materials.