Used MICRO-MATIC WMSA612 #9016211 for sale

MICRO-MATIC WMSA612 scribing / dicing equipment is a fully automated system designed to provide fast and precise multi-axis dicing and scribing solutions. It is suitable for high-precision processing of a wide range of materials such as silicon wafers, MEMS, Glass, PCB, Ceramics, Rigid, and flexible substrates. The unit is equipped with a sophisticated control software that provides 5-axis advanced movement for ultra-precise dicing and wafer manipulation. It is able to consistently perform multiple cuts and features a high cut speed of 10 mm/s to ensure maximum throughput. The machine utilizes four high power spindles to easily scribe, notch, cut, and shape wafers with a maximum thickness of 0.2mm and feature sizes down to 25 microns with high accuracy and repeatability. The machine's CNC tool allows for an easy and intuitive operation with multiple configuration options. The cutting head can be precisely positioned to ensure a consistent finish. Furthermore, this asset operates with a unique touchscreen panel to enable smoother input operation and clarify settings. WMSA612 is supported by a high-performance automatic inspection model that utilizes an integrated laser optical sensing equipment. This allows for precision scribing and dicing as well as repeatable and accurate processing. Additionally, the AFS (Anti Fingerprint System) feature which provides an anti-static layer of protection helps to protect the subsurface structure of the wafer from contamination. In conclusion, MICRO-MATIC WMSA612 scribing / dicing unit is a reliable and versatile machine designed for high precision processing of a wide variety of materials. It features advanced software, high speed cutting, superior technological equipment and auto inspection capabilities. The tool offers excellent precision, repeatability, accuracy and anti-static protection making it one of the best scribing and dicing systems available.