Used MITSUBOSHI DIAMOND INDUSTRIAL / MDI MS-700 #9094449 for sale

MITSUBOSHI DIAMOND INDUSTRIAL / MDI MS-700 is an advanced scribing/dicing equipment used in processing semiconductor materials. The system is a high-precision, highly versatile and cost-effective method of assessing and dividing silicon wafers into subdivisions known as "dicings". The unit comprises of a computer controlled "scribe head", a laser light source and a diamond tool. The scribing head is an electronic stage that precisely moves and positions the diamond tool directly above the surface of the wafer. The laser machine is used to create markings on the wafer's surface and the diamond tool is used to scribe the surface. The diamond tool is composed of two diamond diamond blades that are fixed together vertically and the intersection of the blades determines the scribe break lines. Once the scribing head is properly aligned the laser light source is used to project two precisely generated marking beams on to the wafer. The beams intersect at 90 degree angles and are used to create a "marking anchor point". From here the diamond tools are used to create the actual scribe break lines. The diamond tools are moved by a stepper motor that allows for precise movement of the blade and accurate alignment with the marking beam. The tool is operated at a speed of 25mm/sec and a pressure of 0.8N and is carried out in a "high-speed scribing mode" which enable the scribing of 8 dicings per second. The resulting separated wafers are accurately positioned and are ready for further processing. The tool has a high precision of 0.1mm repeatability and a resolution of 5 microns in eight directions of movement. In addition, MDI MS-700 asset also utilizes a "motion corrector" which stabilizes movement of the tool head during scribing. The model is compact, light weight and its design allows for easy installation in production lines. In conclusion, the MITSUBISHI DIAMOND INDUSTRIALMITSUBOSHI DIAMOND INDUSTRIAL MS-700 is an advanced scribing/dicing equipment used in processing semiconductor materials. The system is equipped with a computer-controlled scribe head, laser light source and diamond tool and is capable of achieving a high precision scribing and dicing process. The unit is suitable for high-volume production and its motion corrector and highly precise movements allows for accurate cutting and dicings of semiconductor materials.