Used MTI / MANUFACTURING TECHNOLOGY MSS 816 #9291528 for sale

MTI / MANUFACTURING TECHNOLOGY MSS 816 is a scribing / dicing equipment for processing flat semiconductor wafers (eg. silicon, glass or Organic substrate wafers). It is ideal for cutting large areas of material or scribing smaller individual chips. The system features dual processing heads which provide the ability to make two simultaneous cuts or scribes. This gives it the advantage of being able to complete more complex tasks in less time and with greater accuracy than would be possible with more traditional means. Each head of MTI MSS 816 is powered by a pair of precision linear motor driven actuators. This gives the unit a high degree of flexibility as it can traverse a full range of axes in both X and Y directions with great accuracy. Both actuators are controlled within sub-micron accuracy. This helps to ensure precision cuts and scribes. The machine is capable of meeting a range of dicing and scribing dimensions as it has a wide range of lens options to suit various wafer sizes. The high accuracy of the motors ensures that all cuts are precise, and the built in temperature control tool keeps cutting operation temperatures consistent. In addition, MANUFACTURING TECHNOLOGY MSS 816 has a variety of protective functions to minimise the chance of damage such as collision detection. It also includes advanced safety features such as an emergency stop button, as well as an energy saving standby mode to ensure long-term operation of the asset. The machine is fully automated with a user friendly, intuitive 4.3" touch screen display. This allows for easy setup and operation of the model functions. In summary, MSS 816 scribing / dicing equipment is a high quality, automated machine capable of precise and accurate wafer processing. It offers the advantage of rapid processing in both flexibility and efficiency due to its dual processing heads and precision linear motor driven actuators. Furthermore, its intuitive control system and safety features make it a great choice for processing flat, semiconductor wafers.