Used MTI NSX 250 #9155944 for sale

MTI NSX 250 is an all-in-one scribing and dicing equipment, designed for precision wafer slicing processing. This full-featured system is ideal for slicing and scribing a variety of thin and delicate wafers in applications such as LED manufacturing, MEMS, andTSV applications. This high-quality unit is built for flexibility and repeatability so that customers can achieve superior product quality and speed. MTI NSX-250 is compatible with a wide variety of substrates, including SiC, GaN, Si, Ge, Quartz, and others. NSX 250 is designed with an advanced cutting structure that enables superior cutting performance, improved efficiency, and a wide range of parameters for maximum flexibility and repeatability. The cutting structure features a baffle-laser design for precise, consistent slice formation and minimizes thermal damage to the material. Its state-of-the-art vision machine uses high-resolution cameras for best-in-class image processing and ensures optimal slicing results. An intuitive operator interface enables easy setup and tool automation for repeatability and long-term highly accurate production. The asset's advanced laser dicing is capable of fast, feature-rich processes and can achieve a high degree of yield and quality. The laser can be centered with cutting coordinates for a fast and efficient setup of high-density patterns, and the laser can also be used for edge machining, drilling, and other applications. The highly customizable design of NSX-250 makes it ideal for many different applications, from simple wafer slicing to complex deposit and manufacturing processes. The model is supplied with a variety of cutting options for a wide range of cutting sizes, from small to large. In addition, MTI NSX 250 is easy to clean and maintain, making it a suitable choice for even the most demanding production environments. MTI NSX-250 is an advanced scribing and dicing equipment with many features, enabling customers to achieve superior slicing performance and accuracy. Its cutting structures, laser dicing, and customizable design make it a suitable choice for a variety of scribing and dicing applications, from simple slicing to complex deposit and manufacturing processes. Equipped with an intuitive control system and precision camera unit, NSX 250 is a reliable solution for fast, accurate, and repeatable wafer slicing and production.