Used N-TEC BW300FA #293643179 for sale

N-TEC BW300FA is a state-of-the-art scribing and dicing equipment designed to meet the needs of customers in the semiconductor industry. BW300FA's unique design offers a fusion of both laser scribing and dicing processing, delivering consistent high-precision, high-speed performance. N-TEC BW300FA's scribing system has a powerful UV laser with a peak power of up to 200W, and it is capable of cutting with a scribing depth of up to 100 μm. It is powered with a servo-drive unit and utilizes custom optics for maximum control and accuracy. The maximum cutting speed is 500mm/sec, and a maximum substrate size of 300mm x 350mm is supported. BW300FA's dicing machine is specially designed for an extra-fine finish. It utilizes diamond-tipped blades and a base pressure tool with a gate valve to maximize a smooth, even cut. The asset is capable of dicing with a wall thickness of down to 0.2mm, and it has a noise level lower than 70db. A maximum substrate size of 170mm x 170mm is supported. N-TEC BW300FA is hi-tech and user-friendly, with an intuitive user interface that is easy to understand. The main operating functions can be activated with a single button, and all of the setup and adjustment parameters are easily customizable. The entire model is well protected, featuring various safety interlocks and an emergency stop button. BW300FA is perfectly suited for scribing and dicing operations in the semiconductor industry. Its powerful, high-precision scribing and dicing capabilities, coupled with its hi-tech and user-friendly design, make it an ideal solution for high-volume production environments.