Used OPTO SYSTEMS OBM-90TP #9378077 for sale

ID: 9378077
Vintage: 2014
Breaker No peripherals 2014 vintage.
OPTO SYSTEMS OBM-90TP is a scribing and dicing equipment designed for precision cutting of optoelectronic components such as laser diodes. The system is capable of dicing with high accuracy to produce round or square dice with burr-free edges and features a contactless scribe / severing process that helps minimize contamination of the dice in cleanroom environments. OBM-90TP is equipped with a monocentric optical bench with a laser diode imaging unit that provides high accuracy and flexibility for positioning and centering the scribe and severing process. The bench is designed to support a range of optical lengths as well as a wide range of fence heights and separate scribe and sever operations. The machine features automatic adjustment of the centering point within the X and Y axes, ensuring alignment accuracy and comfort during operation. OPTO SYSTEMS OBM-90TP uses a low power, solid state laser that is significantly more reliable than its gas laser counterparts, providing stability of scribe / severing results over long periods of use. The laser has been tuned for use with the optical bench for optimum performance with various materials, such as GaAs and InP, enabling seamless integration with the laser scribing process. OBM-90TP has a robust control tool with software featuring an intuitive graphical user interface (GUI) for easy configuration and operation. It is also equipped with a real-time monitor, providing feedback about alignment and process status, as well as a laser asset monitor. This allows operators to verify the process quality and optimize performance. The model is designed to operate in a wide variety of environments, making it suitable for both lab and industrial applications. OPTO SYSTEMS OBM-90TP provides the stability and accuracy required for precise cutting operations on a variety of optoelectronic components. This makes it an ideal choice for cleanroom applications, where precise laser processing and precise dicing of delicate components is essential.
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