Used POWATEC WM-650 #9124434 for sale

POWATEC WM-650 scribing / dicing equipment is a high precision machine designed for use in wafering, ablation, and thinning processes. The machine is capable of both single-sided and double-sided operations. It is highly versatile and can be used in various applications including semiconductor, optical, and medical device manufacturing. The system is built on a robust aluminum alloy frame and is designed to provide high-precision operation. The machine is equipped with a dual motion stage, containing two linear axes and a rotary axis. These axes allow for precise cutting and positioning in three directions and can be operated in a variety of angles. The unit is controlled by a top-of-the-line computer machine that can be integrated with third-party software for automated operation. The tool is capable of scribing / dicing at a maximum depth of up to 10mm and cutting speed up to 20m/s. It has a high-resolution display and can detect imperfections in the wafering process by using a two-point XY detector. This allows the operator to monitor wafer surface texture, chip shape, and other features. The asset can also be equipped with a diamond and carbide cutting heads for precise cutting performance. WM-650 is user-friendly and supported by a comprehensive user manual that outlines operation, maintenance, and setup procedures. Furthermore, POWATEC provides a one-year warranty on all parts of the model, allowing users to purchase the machine with peace of mind. In conclusion, POWATEC WM-650 scribing and dicing equipment is an excellent choice for a range of applications. The system is designed with precision in mind and is user-friendly, backed by expert support and a one-year warranty. Thus, it is worth considering for anyone looking for a superior wafering unit.