Used SEC 2800 #9474 for sale
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ID: 9474
Wafer Size: 2"-3"
Scriber, 2"-3"
Wafers, automatic and semi-automatic modes.
SEC 2800 is a precision scribing and dicing equipment designed for machining applications such as cutting semiconductor wafers and hard materials. This system features a high-resolution motorized x-y stage, as well as automated programmable features which simplify the cutting process. 2800 offers a host of cutting and polishing capabilities, such as the scribing of rectangles, circles and ellipses in various sizes and shapes. This unit can also be used for the cutting of concentric circles and rectangles, as well as for the making of irregularly-shaped components. The speed and accuracy of the cutting and polishing process is highly dependent on the quality of the material being cut or polished, as well as the specific cutting tool used. SEC 2800 also provides automated blade-alignment functions, which allow for precise cutting with minimal waste. This is particularly useful for production-level cutting applications, as it eliminates the need for manual alignment of a cutting tool. In addition, the controller also allows for programming of specific lengths and angles of cuts, reducing the risk of operator error. 2800 also features advanced programming features such as an embedded processor, a feature that allows for automated process control and integration with other scribing machines. This machine is also provided with an advanced laser-marking machine, which can be used to mark the resulting parts with part numbers, serial numbers and other customer-required information. SEC 2800 is a powerful cutting and polishing tool, which can be used in a variety of industrial and commercial applications. Its superior accuracy and repeatability, combined with its intelligent programming features, make it distinctly advantageous in cutting, dicing and other manufacturing operations.
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