Used SHIBAYAMA VG502 MKII 8 #293638203 for sale

SHIBAYAMA VG502 MKII 8 is a scribing and dicing equipment that facilitates the separation of electronic components into individual pieces. SHIBAYAMA VG-502 MKII8 system is designed to quickly and accurately cut through a variety of materials such as ceramics, LCD panel materials and flexible polyimide films. VG502 MK II 8 employs an ergonomic, eye-safe 4-axis scribing and dicing solution. SHIBAYAMA VG502 MK II 8 allows for precise and accurate laser scribing and dicing, making it an ideal solution for any type of manufacturing process. The unit utilizes an ultraviolet excimer laser, which has a wavelength of 308nm and an average output power of 200 watts. A wafer-level camera allows the machine to accurately locate patterns and components on the wafer and then translate that into instructions for the laser. VG502 MKII 8 can be used to scribe components as small as 5 micromets, and can be programmed to automatically adjust to different types of components and materials. The tool is able to scribe and dice a variety of materials, including ceramics, glass, liquid crystal display panel materials and other flexible polyimide films, from a variety of substrates. VG-502 MKII8 features an integrated control module and is capable of controlling the scribing and dicing operation, as well as controlling the navigation and scanner functions. A graphical user interface allows operators to quickly program in a variety of parameters, and the asset also includes a variety of self-diagnostic tools that alert the user to any potential issues. SHIBAYAMA VG502 MKII 8 is a versatile, high-speed model that is capable of quickly and accurately scribing and dicing a variety of materials and components. With its ergonomic design and advanced features, SHIBAYAMA VG-502 MKII8 is the ideal choice for any manufacturing process that requires precise scribing and dicing.