Used TECDIA TEC 1018AR #293641925 for sale

TECDIA TEC 1018AR is a powerful scribing and dicing equipment used for die processing, package singulation, separation of metal components, and other precise tasks. The system consists of a work table and a diamond scribe that is controlled by precise xyz axial motions. The work table can accommodate workpieces up to 24" x 24", and an optional motorized rotary stage can be used to rotate products up to 16". TEC 1018AR is focused on precise micro cutting and processing. The diamond scribe is designed to accurately cut wafers with net cutting depths of up to 45 microns. Additionally, the unit is capable of precise depth profiling, such as notch cutting, by employing an advanced servo mechanism that allows the tip of the scribe to accurately follow the contour of the workpiece. The scribe can be fine-tuned for optimal cutting performance by setting the tip height and deburring parameters. TECDIA TEC 1018AR features a robust Cognex vision machine, consisting of two cameras, which can take multiple pictures of any given wafer and detect defects or other features. This tool can be used for quality control and process improvement by giving real-time feedback to the operator. TEC 1018AR excels in chip separation and package singulation. A builtin chamfering tool option and wafer fusion sensor further enhance its performance in this area by providing precise dicing and separation parameters. The optional wet/dry process chamber is also available to enable process-safe wet/dry etching abilities. TECDIA TEC 1018AR is a cost-effective and precise solution for scribing and dicing needs. With advanced components and a powerful vision asset, it provides the user with quick and accurate results. The model has been designed to perform with minimum maintenance and tremendous reliability, making it a great choice for any die processing requirements.