Used TECDIA TEC-1228AL #9229908 for sale

TECDIA TEC-1228AL is a scribing/dicing equipment that offers precision slices and fast throughput. This system is ideal for cutting wafers, chips, and many other materials for the electronics industry. TEC-1228AL features a 400mm x 400mm rotary stage and a highly accurate laser head that is compatible with the precision laser cutting heads and scriber blocks available from TECDIA. TECDIA TEC-1228AL features a carbon dioxide laser with a power of up to 6000 watts. The maximum pulse frequency of the laser is 1000kHz, providing greater cutting speeds than other laser systems. The laser has a wide range of adjustable parameters such as laser power, pulse rate, pulse duration, and cooling. This allows users to tailor the laser unit to specific applications. The machine features an advanced motion control tool that provides high-resolution motion control for the rotary stage. This provides high accuracy when scribing and dicing, allowing for intricate patterns and shapes to be achieved. The stage can rotate at up to 10000rpm, allowing slicing of ultra-thin wafers and other materials. TEC-1228AL also includes a CCD camera and an encoder for accurately measuring waver slices. It is also equipped with a fiber bundle diode laser, allowing scribing on ultra-thin wafers and other materials with high accuracy and speed. The CCD camera can be used as an alignment tool as well as for the monitoring and measuring of the scribe/dicing process. TECDIA TEC-1228AL is highly efficient and can handle a wide range of scribing/dicing tasks. It is an ideal asset for a variety of industries, including the electronics industry. With its advanced features and precision cutting, it is an ideal model for fast and accurate slicing and dicing of wafers and other materials.