Used TECDIA TEC 2000SS-N #9134161 for sale

TECDIA TEC 2000SS-N is a scribing / dicing equipment that uses laser technologies to provide a full range of scribing and dicing solutions for semiconductor devices and related industries. This system is suitable for most applications involving scribing/dicing processes. The unit is equipped with an advanced laser technology that generates high-precision and accurate scribing/dicing lines. The laser head of this machine can engrave different types of lines; from straight lines, angles and even curves. Moreover, this laser tool allows for variable depth to be set to achieve the desired results for every application. The asset also includes a vacuum table that ensures accurate and stable positioning of the substrate for the entire process. This vacuum table is controlled by a computer which helps to ensure that the substrate is placed in the exact position that is required. The model is capable of cutting a wide variety of substrates from silicon wafers to ceramic substrates and other materials. This equipment is also compatible with a wide range of substrates including quartz, plastic, and metals. This system also has a chip break unit which helps to ensure the materials are cut with precision. The laser optics used on TEC 2000SS-N ensure that the laser beam is tightly focused to get the highest quality results. This machine also includes an Integrated Power Monitoring Tool and auto-calibration control, which helps to monitor the laser output power and automatically adjust it according to the materials and substrate being used in the process. In addition, the asset has a number of safety features to ensure that the users are well protected against potential accidents. These safety features include an Emergency Stop button, a smoke detector, and an optical interlock model. Overall, TECDIA TEC 2000SS-N is a highly advanced scribing / dicing equipment that is suitable for a wide range of applications. This system provides a high-level of accuracy and precision for scribing/dicing tasks and is capable of cutting a variety of materials. Moreover, the laser technology used in this unit is extremely precise and allows for highly precise scribing/dicing results. Additionally, the machine also incorporates a number of safety features to ensure the safety of the users.