Used TECDIA TEC 2002GK #9134162 for sale

TECDIA TEC 2002GK is a state-of-the-art scribing and dicing equipment designed for high-precision semiconductor and optoelectronic applications. The system combines the latest laser scribing technology with a fully automated vision-based dicing process. The advanced laser and vision systems provide consistent high-quality cuts which allow for maximum yield and fewer defects in silicon wafer and other substrates. TEC 2002GK unit includes an automated scribing and dicing process. The machine is capable of scribing and dicing low-cost and high-precision 6-inch wafers with minimal heat-affected zones (HAZs). The precision scribing technology reduces micro-cracks and other defects which can occur during the scribing process. The tool's automated vision-based dicing capabilities can accurately separate a number of different layers on a single wafer with minimal vibrations and particle-causing events. The asset is easy to use - a graphical user interface (GUI) allows users to import and store wafer layouts as well as individual substrate specific details. This makes it easy to set up, monitor, and adjust the parameters of the scribing and dicing process. The model is designed for repeatability and accuracy, with built-in laser and image resolution calibration as well as automatic grit operations for wafer and substrate edge finishes. TECDIA TEC 2002GK is an efficient equipment which can scribe and dice wafers up to 50 times faster than manual operations. The system is capable of accurately slicing and dicing wafer strips as narrow as 10 microns while maintaining a maximum HAZ of 250 microns. The unit is ideal for repeatable scribing and dicing operations and provides significant yields for a variety of substrates. Its advanced technology makes it a reliable choice for a variety of industrial applications.