Used TEMPRESS 602 #83216 for sale
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ID: 83216
Wafer Size: 2" - 3"
Air bearing spindle
2" and 3" wafer selection
Monocular microscope
Automatic indexing, manual chuck rotation.
TEMPRESS 602 is a fully automated scribing and dicing equipment designed for production levels that are beyond the capabilities of manual systems. This system is able to process both rigid and flexible substrates for wafer slicing, accurate and repeatable cutting, and scribing at high throughput speeds. It is an excellent choice for both ceramic and semiconductor applications. 602 is designed with a high-visibility color LCD touch-screen interface for easy programming. It also has a full suite of supporting software for set-up, monitoring and operational analysis. The machine itself is extremely flexible and can be re-configured to accommodate various panel sizes and types, as well as a wide range of substrate materials, including sapphire, quartz, metal and glass. The scribing unit includes a high-precision x-y-t table, which can be programmed in exact sizes down to 0.001mm increments. It also features a 32-bit CPU and a programmable camera zoom lens, which captures images of the substrates with pixel accuracy in real-time, allowing for precise registration prior to cutting. The dicing machine is equipped with a high-speed diamond saw, capable of cutting substrate sizes up to 300x300mm. It comes with an integrated fully-calibrated automatic vision tool that uses multiple cameras and illumination fixtures to ensure accurate alignment and smooth cutting to create reagent-ready substrates. In addition, TEMPRESS 602 is designed for complete asset monitoring, providing diagnostic data on all components, including the condition of the cutting blades and the overall process performance. Real-time dashboards can be configured to display the progress of the scribing and dicing processes, as well as the accuracy and repeatability of the cuts. 602 is an ideal scribing and dicing solution for manufacturing high-quality, repeatable substrates with extreme accuracy. Thanks to its flexibility and state-of-the-art control model, it can produce quality substrates in both small and large volume applications. Furthermore, its user-friendly interface and full equipment monitoring capabilities facilitate complete process control and traceability, providing cost savings to the manufacturer and reducing waste.
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