Used TOKYO SEIKI BSM-700H #175974 for sale

ID: 175974
Band saw with top and tail block cutting.
TOKYO SEIKI BSM-700H is a scribing/dicing equipment designed to make high-precision cuts into hard materials including dielectrics, ceramic, and metals. It uses a combination of laser scribing and mechanical dicing to create precise cuts with a minimum material removal. At the heart of BSM-700H is a patented fiber laser scribing head. It uses a focused laser beam to heat-cut through hard materials, which reduces the cutting time and produces a clean cut edge. The laser head is equipped with a rotary stage allowing the laser to move accurately along one or more axes. The laser head is also programmable so that complex patterns can be rapidly and accurately produced. TOKYO SEIKI BSM-700H also features a mechanical dicing head to make cross hatched cuts. This head uses diamond embedded cutters operating at high speed to produce a clean cut edge free of burrs with minimal material removal. The mechanical head is capable of producing cuts in a variety of shapes and sizes with a high level of precision. It also has a rotary stage that allows the head to move along one or more axes. BSM-700H comes with an optional camera system that allows for visual inspection of the cut. The camera unit includes a CCD camera, zoom lens, and lighting machine to create high quality images with a resolution up to five microns. This tool provides feedback on the progress of the cutting process, ensuring that precision cuts are produced. In addition to its cutting capabilities, TOKYO SEIKI BSM-700H also features a placement asset for accurately positioning materials for cutting. The placement model consists of an X Y Z manipulator and vacuum chuck, allowing for accurate alignment and positioning of materials for the cutting and inspection processes. BSM-700H is designed for use in a variety of applications, including microelectronics and semiconductor manufacturing. It offers a high level of precision and repeatability, allowing for clean and accurate cuts on a wide range of materials. With its combination of laser scribing and mechanical dicing, TOKYO SEIKI BSM-700H is an ideal solution for creating components with tight tolerances and intricate patterns.
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