Used ULTRA TEC 8560.3 #9363380 for sale

ULTRA TEC 8560.3 is an automated scribing and dicing equipment ideal for semiconductor production lines. This all-in-one solution features a high-precision 2-axis motion control design, allowing for up to 10,000 scribes per hour with a positional accuracy of 10 µm, making it perfect for die separation of a wide variety of substrates. It also offers an automated cleaning system and an adjustable focal plane to ensure consistently high yields of clean, diceable wafers. The machine's laser module operates at 3 wavelengths from a range of 780nm, 810nm, and 1064nm, ensuring compatibility with a variety of substrates. The wide range of power configurations, ranging from 1W up to 200W, makes it suitable for both scribing and dicing applications. A single pulse beam with an adjustable intensity of up to 400 Joules/cm² allows for finely tuned cutting parameters and high accuracy results. The integrated enclosure ensures a safe working environment with a temperature-controlled atmosphere and low dust levels. A closed-loop vacuum control unit provides precise pressure regulation optimised for the most delicate substrates such as Foils and Bondpads. An anti-contamination machine removes residual contaminants from the cutting process, ensuring clean results and preventing contamination of substrate material. The versatile ULTRA TEC 8560.3 supports a wide range of substrates and die sizes, cutting both ceramic and metal substrates safely, even at high speeds. Equipped with an automated wafer handling tool and easily programmable parameters, the machine offers effortless reproducibility of cuts, enabling high through-put without sacrificing quality. The flexible, user-friendly operation makes ULTRA TEC 8560.3 easy to use and maintain, allowing operators of all levels to get the most out of the asset.