Used ULTRATECH (Scribing / Dicing) for sale

Ultradisc 6 is one of the scribing/dicing equipment offered by ULTRATECH, a leading manufacturer in the field. These systems are designed to provide precise and efficient cutting solutions for various industries, including semiconductor, electronics, and solar. ULTRATECH's scribing/dicing units offer several advantages. Firstly, they utilize advanced analogues technology, ensuring high precision and accuracy in cutting various materials, such as silicon wafers, glass substrates, and ceramic tiles. The analogues technology allows for a clean and smooth cut, minimizing the risk of damage to the material. The Ultradisc 6 is a highly flexible system that offers customizable cutting parameters to meet specific customer requirements. It utilizes a multi-die alignment technology, enabling simultaneous cutting of multiple chips and reducing cycle time. The system also features advanced automation and wafer handling capabilities, ensuring efficient and reliable operation. Another example of ULTRATECH's scribing/dicing system is the Ultradisc V. It is a versatile system that is capable of handling various materials and wafer sizes. The Ultradisc V also offers advanced vision alignment capabilities and real-time process monitoring, ensuring precise cutting and optimal yield. Overall, ULTRATECH's scribing/dicing machines are known for their advanced analogues technology, high precision, flexibility, automation, and reliable performance. These tools enable manufacturers in the semiconductor and electronics industries to achieve efficient and cost-effective cutting processes, ultimately improving their overall productivity and product quality.