Used YASUNAGA TW-320-1 #9228628 for sale

YASUNAGA TW-320-1
Manufacturer
YASUNAGA
Model
TW-320-1
ID: 9228628
Vintage: 2011
Diamond wire saw 2011 vintage.
YASUNAGA TW-320-1 is a scribing / dicing equipment ideal for precision device packaging or substrate splitting. It is a high-performance machine designed to provide accurate and reliable scribing and dicing of all types of material. The system makes use of new, advanced technologies that have been optimized for maximum performance. TW-320-1 is a four-axis machine consisting of a Z-axis motor, a horizontal table, a spindle, an X-axis motor, and a Y-axis motor. The spindle is equipped with a number of programmable options which allow the user to adjust speed, depth, and angle of cut. Additionally, it is also equipped with a special scribing mechanism for spinning and scribing operations. The target material is placed on the horizontal table, and the spindle is then controlled by the X and Y axes to move the target material to a specific location where the scribing or dicing operations can be performed. YASUNAGA TW-320-1 is driven by a powerful microprocessor-controlled unit. This machine is capable of performing scribing and dicing operations with high speed and precision. It also makes use of advanced vision systems that enable it to precisely identify target material and accurately adjust the parameters for scribing and dicing. TW-320-1 is capable of both programmed operations and manual operations, making it adaptable to a wide range of production requirements. YASUNAGA TW-320-1 is equipped with a number of safety features to protect against unnecessary damage to the target material. These include the programmed speed and depth settings for each cut, the ability to detect missing material from the work-piece, the error detection and correction tool, and the self-diagnosis asset. Additionally, TW-320-1 is equipped with a powerful monitoring model that monitors machine performance and analysis of scribed results in order to ensure optimum machine accuracy. YASUNAGA TW-320-1 can be used to perform a variety of operations, from precision device packaging to substrate splitting to scribing and dicing operations. Its powerful microprocessor-controlled equipment and advanced vision systems make it capable of ensuring rapid and accurate scribing and dicing operations. Additionally, its safety features and monitoring capabilities make it a reliable and safe system for use in a variety of contexts.
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