Used YASUNAGA TW-320 / TW-320C #9174457 for sale

ID: 9174457
Multi diamond wire saw system 2007-2010 vintage.
YASUNAGA TW-320 / TW-320C is a high performance scribing/dicing equipment ideal for inspection, wafer slicing, and dicing applications. This system is designed to process a wide range of wafer materials such as silicon, sapphire, glass, and ceramics, and features a unique double stage scribing/dicing mechanism. TW-320 / TW-320C is equipped with a powerful microprocessor and an enhanced control unit, allowing for high precision positioning and a stable working environment. The machine also features a unique spindle exchange mechanism which enables quick replacement of blades, reducing downtime and increasing productivity. The tool is capable of scribing/dicing wafers up to 6" in diameter at an extremely high speed. YASUNAGA TW-320 / TW-320C is a reliable and efficient machine, capable of high accuracy and repeatable performance for a wide range of materials. The spindle exchange mechanism also allows for different blade types to be used for specific wafer types, as the need arises. The integrated monitoring asset makes for easy operation, providing visual, audible and tactile feedback for every process step. TW-320 / TW-320C features an extended worktable that can hold up to 10 wafers at once - allowing for faster dicing times. The model also includes a variety of basic functions such as an automatic break-point detection, and an operating manual that facilitates quick and easy operation. For added quality assurance, YASUNAGA TW-320 / TW-320C is equipped with an air-pressure feeder and a vacuum hopper, ensuring a consistent flow of dicing material and optimal working conditions. The machine is also fully compliant with the latest safety standards - having passed rigorous industry tests and acquired recognized safety certification. In conclusion, TW-320 / TW-320C is a highly efficient and user-friendly scribing/dicing equipment capable of a variety of applications and offering excellent precision and reliability. Its innovative design and robust components make it an excellent choice for any wafer processing needs.
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