Used STRASBAUGH 6DS-SP CMP #166127 for sale

STRASBAUGH 6DS-SP CMP equipment is an advanced wafer grinding, lapping and polishing system specifically designed to provide high performance surface conditioning to semiconductor wafers. This unit is an automated, three-axis controlled machine that uses an extended diamond surface to finish a wide variety of surface structures on semiconductor wafers. 6DS-SP CMP machine is capable of grinding and lapping 6", 8", 10", 12", and non-standard (customer-specific) diameter wafers. The surface finish of a wafer can range from a fine-grain finish to a highly polished surface as fine as 50nm (nanometers). In addition, the 6DS-SP tool can be used to achieve mirror-like lapping surfaces with a concave curvature and tight profile control to achieve the desired structural geometries. The asset utilizes diamond grinding wheels and slurry abrasives to efficiently grind, lap, and polish the semiconductor wafer with extreme precision and accuracy. The grinding wheels are mounted on a robotic arm which moves with a high speed and accuracy while the slurry is used as a lubricant to ensure that the wafer surface is flat and smooth. The piezo-driven actuator transforms vertical and angular movements which keep the wafer intact and provides a uniform flat surface finish on the entire wafer. STRASBAUGH 6DS-SP CMP model is equipped with a multi-pattern, multi-axis scan control driver that provides precise movements of the wafer during the grinding process and ensures that all parts of the wafer are evenly ground, lapped, and polished. This control also allows for high accuracy and repeatability in terms of the surface profile which is achieved on each wafer. Lastly, 6DS-SP CMP equipment offers advanced diagnostics that allow for the integration of a device into the system and monitoring of the status and performance of various parts of the machine. This advanced feature helps the machine to run smoother and safer, minimizing downtime and optimize the performance of the unit. In summation, STRASBAUGH 6DS-SP CMP machine is a high-performance, automated machine that is capable of grinding, lapping and polishing wafers with extreme accuracy and precision. This tool boasts a variety of performance and safety features which maintain the high quality and efficiency of the process.