Used AMAT / APPLIED MATERIALS 0010-13034 #293650276 for sale

AMAT / APPLIED MATERIALS 0010-13034 sputtering equipment is designed to provide reliable, controlled, and high-quality thin film deposition for applications in a variety of industries. This system enables cost-effective production of thin-film multilayers with controlled thickness and uniformity. The unit consists of two magnets, a target and two substrate holders, which provide a uniform sputtered film deposition. The two magnets overlap with each other, creating an annular enclosure of the sputtering area which helps to produce high-quality thin-film coating materials. The entire vacuum chamber can be easily swapped out to quickly change the sputter process to create different thin-film materials. The anode and cathode have shielding to extend the life of the sputter targets. AMAT 0010-13034 features seven process parameters which are controlled by a personal computer via a man-machine interface. These parameters include sputter power, sputter time, deposition pressure, vacuum quality, substrate temperature, gas flow, and post-sputtering support. By controlling these parameters, one can achieve thin-film deposits that are uniform and consistent. The target and substrate holders can be easily accessed and replaced without taking the sputter chamber out of operation. The target holder and substrate holders are self-sensing and keep each substrate at a constant temperature during the sputter process. The target materials can be changed without venting chimney stack allowing for rapid coating changes. In addition to the user-friendly man-machine interface, APPLIED MATERIALS 0010-13034 sputter machine has a robust design that offers superior yield, reliability and long-term stability. It is designed to incorporate multiple sensors to observe the status of the vacuum tool and detect any potential faults. It also offers a wide range of process gases as well as closed-loop feedback control systems to increase throughput and quality control. Overall, 0010-13034 is an advanced sputtering asset that is ideal for producing thin-film deposits with a high degree of uniformity and predictability. Its user-friendly interface and robust design make it an ideal solution for high-end thin-film deposition applications.