Used AMAT / APPLIED MATERIALS 1200L #9379482 for sale

AMAT / APPLIED MATERIALS 1200L
ID: 9379482
Vintage: 2019
Sputtering system Target: ITO / SiO2 (3) ORELIKIN LEYBOLD VACCUM / WSU 2001H Dry pumps (3) STERLING FLUID SYSTEM (18) SHIMADZU / TMP-1503LM Turbo pump (2) Air tanks 2019 vintage.
AMAT / APPLIED MATERIALS 1200L is a state-of-the-art sputtering equipment designed for thin film deposition in the semiconductor and microelectronics industry. Sputtering is a widely-used technique for depositing thin films of various materials onto substrates by bombarding a target material with energetic ions. AMAT 1200L model by AMAT is known for its precision, reliability, and versatility, making it a popular choice for high-volume production environments. One of the key features of APPLIED MATERIALS 1200L is its advanced cathode design, which allows for precise control over the sputtering process. The system utilizes magnetron sputtering technology, where magnetic fields are used to enhance the plasma density and increase the efficiency of the sputtering process. This results in high uniformity and repeatability of thin film deposition across large substrate areas, essential for producing high-quality semiconductor devices. 1200L unit is equipped with multiple cathodes, allowing for co-sputtering of different materials and precise composition control of the deposited films. This capability is particularly important for applications requiring multilayer thin films or alloy coatings with specific material properties. Additionally, the machine features a fully automated process control tool with recipe management capabilities, enabling users to easily program and execute complex deposition sequences for different material combinations. In terms of substrate handling, AMAT / APPLIED MATERIALS 1200L asset is designed to accommodate various substrate sizes and types, including wafers, glass panels, and flexible substrates. The model's robotic substrate handling equipment ensures precise positioning and alignment of the substrates during deposition, resulting in high yield and reproducibility in production processes. The vacuum chamber of the system is equipped with advanced pumping and gas flow control systems, allowing for rapid pump-down and accurate control of the process gas environment during deposition. AMAT 1200L also features advanced plasma diagnostics and monitoring capabilities, enabling real-time process monitoring and control for optimal thin film quality and uniformity. The unit is equipped with in-situ metrology tools for measuring film thickness, composition, and other key parameters during deposition, allowing users to quickly adjust process conditions to meet desired specifications. Furthermore, APPLIED MATERIALS 1200L machine is designed with industry-leading safety features to ensure user protection and compliance with safety regulations. The tool's software interface provides an intuitive user experience, with visualizations of process parameters and real-time monitoring of asset status. Additionally, the model is fully compatible with industry-standard factory automation protocols, allowing for seamless integration into a wide range of production environments. Overall, 1200L sputtering equipment represents a cutting-edge solution for thin film deposition in the semiconductor industry, offering high precision, reliability, and productivity for a wide range of applications. Its advanced features, versatile design, and user-friendly interface make it a preferred choice for manufacturers seeking to achieve superior thin film quality and performance in their products.
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