Used AMAT / APPLIED MATERIALS ATON 1600 #9018803 for sale
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ID: 9018803
Vintage: 2006
System
Application:
Coating method: MF Twin Mag Sputtering
Coating direction: sputter down
Coating influenced by gases
Electrical connection
3 phase, PE, N, AC 400 V, 50 Hz, Full-load-current: 986 A
Cycle time per carrier M01: ca. 60 sec.
Brut capacity (at 100% uptime): Aton: max. 5400 Wafer / h
Targets: Silicon M06 - Planar Twin Mag Cathode M08 - Rotatable Twin VAC - Mag Cathode
Gas: Ar - argon, N2 - nitrogen, NH3 - ammonia
Compressed air: pressure: 6 bar - 8 bar
Wafer: 150 mm x 80 mm
Carrier material: Carbon (CFC) 1800 mm x 920 mm, 90 Wafer / Carrier
Loader / Unloader / Carrier transport system: Jonas & Redmann
Retrofit: upgraded lock valve in 2008, upgraded cathode M08 to rotatable in 2011
Flooded with N2
Cooling water: emptied
2006 vintage.
AMAT / APPLIED MATERIALS ATON 1600 sputtering equipment is a powerful, versatile system for coating thin films onto substrates. It uses a combination of physical and chemical vapor deposition methods to apply thin layers of metallic, dielectric, and semiconductor materials onto wafers, substrates, and other components. It is designed for high-volume production and research, with a variety of options for customization and flexibility. AMAT ATON 1600 has a chamber with a maximum size of 600mm x 600mm x 250mm and can hold up to 30 wafers. It features auto chamber cleaning and wafer-handling jigs that adjust to fit the needs of the job. It has an 8" plasma generator capable of generating plasma power up to 2000W and offers either Single- or Multi-Target Sputtering with several electrode configurations. It also comes configured with a film monitor, resistivity monitor, and wafer temperature sensors. The addition of a Load Lock allows the unit to operate uninterrupted during the cooldown phase and shortens overall cycle times. The machine can be used for conventional physical sputtering, Nano-Coating, Reactive Sputtering, Sheet Resistance, and Overlay. Its power and flexibility make it suitable for many applications such as semiconductor, MEMS, metallized ceramics, and IR lenses. The tool has an intuitive graphical user interface, an automated process control asset, an electron beam gauge, and can be remotely monitored and operated from a single location. Advanced process control options include recipe programming, process parameter optimization, and real-time feedback and audit. The model is also capable of diagnostics and ad-hoc experiments. Overall, APPLIED MATERIALS ATON 1600 sputtering equipment is an advanced, powerful tool for coating thin films on substrates. Its flexible design and advanced features make it ideal for high-volume production and research applications. The system is designed to be efficient, precise, and reliable, allowing users to maximize the quality and yield of their thin film coatings.
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