Used AMAT / APPLIED MATERIALS New Aristo (NAR) 1200 #293763723 for sale
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ID: 293763723
Vertical inline sputtering system
Applications: SiO2 / ITO
Throughput: 332 Substrates/h
Compressed air pressure: 5.5 Bar
Chamber:
Material: Stainless steel
Vacuum leakage: ≤1x10-8 mbar l/sec
Carrier transfer system:
AC Motor
Conveyor
One feedthrough per chamber
Substrate carrier:
Material: Aluminum
Dimensions:
1700 x 1100 mm²
1700 x 980 mm²
Vacuum measuring equipment:
Pirani vacuum meter type: TPR 280
Cold Ionization vacuum type: PKR 251
Capacitance vacuum meter type: MKS Baratron 627
Sputter cathode:
Type: DC Magnetron
Material of backing plate: Cooper with cooling channel
Target fixing: Bonding
Magnetic field:
SiO2: Magnet array
ITO
Target size:
ITO: 1400 x 190 x 6/9 mm
SiO2: 100 x 100 x 16 mm
Cooling water specification:
Pressure minimum / Maximum: 5/7 bar
Water inlet temperature range: 15° C-25° C
Constant temperature: ±2°C
Hardness of water: 6-8°dH
pH Value: 8-10
Foreign particles:
Size: Maximum 100 µm
Concentration: Maximum 10/cm³
Dissolved C1: Maximum 20mg/l
Dissolved CO2: Maximum 15 mg/l
Sputter gas:
Argon
Argon/Oxygen (95/5)
Oxygen
Nitrogen
Ambient requirements:
Temperature machine control room: 20°-25° C
Relative humidity: ≤ 60 %
Vacuum data:
Entrance / Exit chamber: ≤ 2 E^-02 hPa
Transfer chamber: ≤ 5 E^-06 hPa
Process chamber: ≤ 5 E^-06 hPa
Purity of sputter gas: 99.999%
Turbo molecular pump
Rotary pump
Roots pump
ADVANCED ENERGY MDX Power supply
Heater system
PC
Operating system: Windows
Power supply: 400 V, 3 Phase, 60 Hz, 5 Wires (3 AC, N, PE).
AMAT New Aristo (NAR) 1200 is a cutting-edge sputtering equipment designed for high-performance thin film deposition processes in semiconductor manufacturing and advanced materials research. This advanced tool combines precision engineering, innovative technology, and intelligent automation to deliver unparalleled control, repeatability, and productivity in thin film deposition applications. At the core of the NAR 1200 system is its highly efficient sputtering process, which involves the deposition of thin films by bombarding a target material with energetic ions to eject atoms that then adhere to a substrate surface. This process allows for the precise control of film thickness, composition, and microstructure, making it ideal for a wide range of applications, including semiconductor device fabrication, optical coatings, and thin film solar cells. The NAR 1200 is equipped with a state-of-the-art magnetron sputtering source that offers superior film uniformity and deposition rates. The unit features advanced power supplies and control algorithms that enable precise tuning of process parameters such as power, gas flow rates, substrate temperature, and deposition pressure. This level of control ensures consistent and reproducible film properties, critical for manufacturing processes requiring high yields and performance. One of the key features of the NAR 1200 is its advanced automation capabilities, which streamline operation and maximize throughput. The machine is equipped with a user-friendly interface that allows for easy programming of deposition recipes, monitoring of process parameters in real-time, and remote diagnostics and maintenance. Additionally, the NAR 1200 features advanced software algorithms that optimize process parameters for specific thin film materials and deposition conditions, resulting in improved film quality and reduced cycle times. The NAR 1200 tool is designed for versatility and flexibility, with the ability to accommodate a wide range of substrate sizes, shapes, and materials. The asset can be configured with multiple sputtering sources, enabling co-sputtering of different materials to create complex multilayered films with tailored properties. This flexibility makes the NAR 1200 ideal for research and development applications where exploring new material combinations and structures is essential. In terms of performance, the NAR 1200 excels in terms of film quality and uniformity, with excellent adhesion, density, and low defect levels. The model offers high throughput capabilities, thanks to its efficient process control and automation features, allowing for rapid deposition of thin films with minimal downtime. The NAR 1200 also offers industry-leading process stability and reliability, ensuring consistent performance over extended run times. Overall, APPLIED MATERIALS New Aristo (NAR) 1200 sputtering equipment stands out as a top-of-the-line tool for thin film deposition applications in the semiconductor industry and beyond. With its advanced technology, precision control, and superior automation features, the NAR 1200 offers unmatched performance, flexibility, and reliability for demanding thin film deposition processes.
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