Used ANATECH / TECHNICS HUMMER X #126411 for sale

ANATECH / TECHNICS HUMMER X sputtering equipment is a versatile tool for thin film deposition of metals and oxides. This system is capable of producing high-quality films over wide areas with exceptional control over composition, film thickness, and deposition rate. The unit consists of a vacuum chamber, a gas manifold and a power supply. The vacuum chamber enables the deposition onto a substrate under very low pressure conditions. The power supply provides the necessary power to generate ions in the plasma. ANATECH HUMMER X sputtering machine utilizes Pulsed and Direct DC Sputtering technology. Pulsed DC Sputtering involves changing the absolute voltage applied to the sputtering target, to modify the ionization process in the plasma and, depending upon the parameters used, can be used for both coating and etching processes. Direct DC Sputtering allows for the modification of the film structure by continuous modification of the target substrate potential, while maintaining a constant film deposition rate. In order to disperse the sputtering materials onto the substrate, the tool utilizes a process called cathode arcs. This involves a high-voltage electric field, which arranges the material onto the target. The target material is then sputtered into positive and negative ions which are then propelled towards the substrate, where a reaction occurs between the ground material and the gas atoms, forming the requisite deposit on the substrate. In order to ensure a smooth and uniform deposit, the sputtering process is monitored with a Quadra Secondary Electron Optical Emission Detector (QSEC) which allows for the precise measurement of the rate of deposition. The asset also utilizes a small, high-power Pulse Magnetron Source (PMS) to enable the deposition of more exotic materials than what TECHNICS HUMMER X can provide alone. HUMMER X is also equipped with a computer-controlled end-point detection model to ensure the completion of desired film thickness within the specified parameters, at the end of the sputtering deposition process. Furthermore, the high versatility of the equipment allows for the compatibility of a wide range of optional accessories designed for a variety of deposition processes. In short, ANATECH / TECHNICS HUMMER X sputtering system is an innovative tool that offers precise control over film deposition parameters, including film thickness, composition, and rate. Its versatile design enables the use of a variety of optional accessories, and its computer-controlled end-point detection unit ensures the highest possible precision. With all of these features combined, ANATECH HUMMER X is an ideal solution for the thin film deposition of metals and oxides.